ER1122

Adhesive Epoxy Resin

ER1122 two part Epoxy encapsulation and potting compound for general purpose applications with a clear amber finish. It can be hot or cold cured, and the cured compound is a tough resin.

ER1448

Specialist Radio Frequency Encapsulant

Specialist radio frequency encapsulation resin formulated primarily for encapsulating radio frequency transmitters in applications for the automotive and aerospace sensor markets but can perform well in a wide range of harsh operating conditions making it suitable for industrial and marine applications.

ER2218

Low Viscosity Flame Retardant Epoxy Resin

ER2218 is a very low viscosity epoxy resin with excellent thermal stability. The product has been specifically designed for compatibility with reflow applications, therefore remaining stable for short term, high temperature excursions.

ER2219

Single Component Epoxy Resin

ER2219 is a versatile single component epoxy resin suitable for use as a glob-top resin or for dipping hybrid circuits and individual components which require discrete concealment. The resin is semi-thixotropic allowing for efficient heat curing and a faster process time. ER2219 meets UL94 V-0 approval as a flame retardant resin.

ER2225

High Temperature Resistant Epoxy Potting Compound

ER2225 a black epoxy potting compound formulated to meet the exacting requirements of the automotive industry, although will find application in a wide range of industries where high temperature and chemical resistance are called for.

ER2183

Thermally Conductive Epoxy Potting Compound

ER2183 is a thermally conductive epoxy resin meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke emission.

ER2223

High Chemical Resistance Epoxy Potting Compound

Highly chemical resistant epoxy potting compound which has been specially formulated to meet harsh operating conditions of under-hood automotive applications.

ER1426

Transparent / Colourless Epoxy Encapsulation Resin

ER1426 is a two part potting and encapsulation resin designed for powder bonding and impregnation applications.