Electronic and General Purpose Cleaning

Wash away the worry of contaminants

  • Flux Removal
  • Metal Degreasing
  • Flammable & Non-flammable
  • Bulk & Aerosol
  • Water & Solvent Based

Cleaning is an essential process within electronics manufacture and has been used for many years to remove potentially harmful contaminants during PCB manufacture.

Such contaminants include flux, solder and adhesive residues, and other more general contaminants such as dust and debris present from other manufacturing processes.

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The purpose of cleaning, specifically within the rapidly expanding electronics industry, is to essentially improve product lifetime by ensuring good surface resistance and by preventing current leakage leading to PCB failure. This developing market sees modern and future electronics becoming smaller and smaller and the requirement for high performance and reliability is stronger than ever. In order to achieve good insulation resistance and ensure adequate adhesion of conformal coatings and encapsulation resins, the cleanliness of the electronic assemblies is essential.

There are many stages where cleaning is required; prior to stencilling and soldering in order to remove contaminants from the many previous production stages, after stencilling to remove excess solder paste/adhesive and after soldering to remove corrosive flux residues and any solder balls.

In industry today, many manufacturers are turning to ‘no clean’ processes, implying that cleaning is not required after soldering. In the ‘no clean’ process the solids content of the flux is lower than traditional types, however they still contain rosin and activator. Such residues, along with any other unwanted elements collected due to the missing cleaning stage, could cause issues with adhesion and possibly affect the performance of the protecting media applied, ie. Encapsulation Resins or Conformal Coating. It can therefore be stated that even with advances in new technologies, such as ‘no clean’ fluxes, cleaning is still an essential multi-stage process within the electronics industry.

Finally, there are also cleaning stages required for the removal of coatings and adhesives when re-work is necessary, for the cleaning of individual components and for maintenance of the production line.

  • how to clean electrical contacts
  • Cleaning


    ROC  - Reflow Oven Cleaner

    Reflow Oven Cleaner

    500ml - 5 Litre - 25 Litre

    Product code: ROC500ML - ROC05L - ROC25L

    A specially formulated micro-emulsion for cleaning reflow ovens and wave solder machines, Reflow Oven Cleaner is designed to remove all types of flux residues. The cleaner is also suitable for many general degreasing applications. Regular use of Reflow Oven Cleaner will prevent build up of condensed flux.

    Key Properties:
    • Specially formulated micro-emulsion for cleaning reflow ovens and wave solder machines.
    • Removes all types of flux residues
    • Suitable for general degreasing applications
    • Regular use prevents flux build up
    • Helps maintain efficient running of equipment
    • Contains inhibitors to prevent corrosion
    • Low toxicity
    • non-flammable
    • low odour

    Additional information

    Product data sheets
    ROC (tds) Download

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