Choose another country or region to see content specific to your location.

Epoxy Potting Compounds

Meeting the challenge of challenging environments

Electrolube resins in use.
  • Very tough systems
  • Easy to apply
  • Generally two component
  • Low shrinkage during curing
  • Low coefficient of thermal expansion
  • Excellent protection against humidity and harsh chemicals
  • DDM/MDA free

Electrolube epoxy resins are specialist systems for potting and encapsulating printed circuit boards (PCBs) and electronic components. Resin systems are designed to protect the device from harsh environments acting as a barrier against contaminates such as moisture, chemicals or physical shock and vibrations.

More info > Download product selector chart > Download product brochure >

Formulated to exhibit excellent electrical and physical properties, Electrolube epoxy resin systems are created in order to protect the electronic device allowing it to operate in some of the harshest conditions, while in the process maintaining and enhancing performance.

Epoxy resins are generally much harder compounds than the other resin chemistries, once cured they offer superb mechanical and chemical protection. This makes them an ideal choice for some of the toughest applications such as the automotive, aerospace and marine industries.

Electrolube epoxy resins also exhibit excellent thermal properties, dissipating heat away from components

Basic Key Properties:

  • Very tough systems
  • Easy to apply
  • Generally two component
  • Low shrinkage during curing
  • Low coefficient of thermal expansion
  • Excellent protection against humidity and harsh chemicals
  • DDM/MDA free

For More details on the Chemistry of Epoxy resins, have a look at our knowledge centre articles below:

Encapsulation Resins

Epoxy Potting Compound

ER2183 - Black Epoxy Resin

ER2183
Black Epoxy Resin

250g and 500g resin pack, 1KG, 5KG, 25KG kits

Product code: ER2183RP250G - ER2183RP500G - ER2183K1K - ER2183K5K - ER2183K25K


ER2183 is a thermally conductive epoxy resin with UL flame retardant approval technology which results in relatively low toxicity fumes and low smoke emission.

It is a low viscosity system ideal for potting and encapsulating electronics or components with limited spacing and where thermal dissipation is required. It has a wide operating temperature range and can be used in a variety of potting and encapsulation applications.


Key Properties:
  • Thermally Conductive Epoxy
  • Low viscosity alternative to ER2220: 5000mPa s
  • High thermal conductivity; 1.10W/m.K
  • Easy to mix, uses non-abrasive fillers
  • Wide operating temperature (-40°C to 130°C)
  • Meets UL94
  • RoHS Compliant

Additional information

Product data sheets
ER2183 (tds) Download

Log into our MSDS database for Safety Data Sheets: MSDS