Choose another country or region to see content specific to your location.

Epoxy Potting Compounds

Meeting the challenge of challenging environments

Electrolube resins in use.
  • Very tough systems
  • Easy to apply
  • Generally two component
  • Low shrinkage during curing
  • Low coefficient of thermal expansion
  • Excellent protection against humidity and harsh chemicals
  • DDM/MDA free

Electrolube epoxy resins are specialist systems for potting and encapsulating printed circuit boards (PCBs) and electronic components. Resin systems are designed to protect the device from harsh environments acting as a barrier against contaminates such as moisture, chemicals or physical shock and vibrations.

More info > Download product selector chart > Download product brochure >

Formulated to exhibit excellent electrical and physical properties, Electrolube epoxy resin systems are created in order to protect the electronic device allowing it to operate in some of the harshest conditions, while in the process maintaining and enhancing performance.

Epoxy resins are generally much harder compounds than the other resin chemistries, once cured they offer superb mechanical and chemical protection. This makes them an ideal choice for some of the toughest applications such as the automotive, aerospace and marine industries.

Electrolube epoxy resins also exhibit excellent thermal properties, dissipating heat away from components

Basic Key Properties:

  • Very tough systems
  • Easy to apply
  • Generally two component
  • Low shrinkage during curing
  • Low coefficient of thermal expansion
  • Excellent protection against humidity and harsh chemicals
  • DDM/MDA free

For More details on the Chemistry of Epoxy resins, have a look at our knowledge centre articles below:

Encapsulation Resins

Epoxy Potting Compound

ER2218 - Black Epoxy Resin

ER2218
Black Epoxy Resin

250g resin pack - 5kg

Product code: ER2218RP250G - ER2218K5K


ER2218 is a low viscosity epoxy resin with excellent thermal stability. The product has been specifically designed for compatibility with reflow applications, therefore remaining stable for short term, high temperature excursions. The system utilises a hardener free of DDM or other aromatic amines. The flame retardant filler used is a non-halogenated 'clean' type leading to relatively low toxicity fumes and low smoke emission.

Its extremely low viscosity makes it a perfect choice for potting electronics which have complex geometries or limited spacing and operates over a very wide temperature range.


Key Properties:
  • Low viscosity
  • Flame retardant, meets UL94 V-0
  • Excellent high temperature stability
  • Ideal for applications involving thermal cycling or extreme temperatures for short periods of time, such as reflow applications

Additional information

Product data sheets
ER2218 (tds) Download

Log into our MSDS database for Safety Data Sheets: MSDS