Choose another country or region to see content specific to your location.

Epoxy Potting Compounds

Meeting the challenge of challenging environments

Electrolube resins in use.
  • Very tough systems
  • Easy to apply
  • Generally two component
  • Low shrinkage during curing
  • Low coefficient of thermal expansion
  • Excellent protection against humidity and harsh chemicals
  • DDM/MDA free

Electrolube epoxy resins are specialist systems for potting and encapsulating printed circuit boards (PCBs) and electronic components. Resin systems are designed to protect the device from harsh environments acting as a barrier against contaminates such as moisture, chemicals or physical shock and vibrations.

More info > Download product selector chart > Download product brochure >

Formulated to exhibit excellent electrical and physical properties, Electrolube epoxy resin systems are created in order to protect the electronic device allowing it to operate in some of the harshest conditions, while in the process maintaining and enhancing performance.

Epoxy resins are generally much harder compounds than the other resin chemistries, once cured they offer superb mechanical and chemical protection. This makes them an ideal choice for some of the toughest applications such as the automotive, aerospace and marine industries.

Electrolube epoxy resins also exhibit excellent thermal properties, dissipating heat away from components

Basic Key Properties:

  • Very tough systems
  • Easy to apply
  • Generally two component
  • Low shrinkage during curing
  • Low coefficient of thermal expansion
  • Excellent protection against humidity and harsh chemicals
  • DDM/MDA free

For More details on the Chemistry of Epoxy resins, have a look at our knowledge centre articles below:

Encapsulation Resins

Epoxy Potting Compound

ER2221 - Thermally Conductive Epoxy Resins

ER2221
Thermally Conductive Epoxy Resins

250g - 5KG

Product code: ER2221RP250G - ER2221K5K


ER2221 resin has been formulated as high temperature resistant and thermally conductive potting compound which retains excellent characteristics throughout thermal cycling. ER2221 is coloured black, while ER2222 is a red version, otherwise the cured resins do not differ in their physical properties. Both exhibit excellent thermal resistance up to an operating temperature of 150°C and have an enhanced thermal conductivity value in comparison to other encapsulants of 1.20W/m.K.

Both resin systems are filled, but the viscosity of the mixed system is low in comparison to other resins with a similar filler loading. This allows the mixed resin to be easily mixed and can flow between components and devices with limited spacing.

ER2221 is an excellent choice for encapsulating an electronic device which requires high levels of thermal resistance and protection such as automotive, aerospace, industrial or other applications which are subject to harsh environments.


Key Properties:
  • Two component black epoxy resin
  • Excellent high temperature resistance up to 150°C
  • Enhanced thermal conductivity
  • Low viscosity for a filled system;
  • Does not contain abrasive fillers; low wear on dispensing machinery
  • UL94 V-0 Approval
  • RoHS Compliant

Product data sheets
ER2221 (tds) Download

Log into our MSDS database for Safety Data Sheets: MSDS