Electrolube Polyurethane resins are specialist systems for potting and encapsulating printed circuit boards (PCBs), electronic components and devices. Polyurethane resin systems are designed to insulate the device from harsh environments acting as a barrier against contaminates such as moisture, chemicals and protection against physical shock and vibrations.More info > Download product selector chart > Download product brochure >
Polyurethane encapsulants offer several advantages over epoxies and silicones. They provide chemical, dust and moisture resistance, as well as exhibiting excellent electrical resistance and flexibility. They also have good adhesion to most substrates, both metal and plastic.
Due to the nature of the urethane bond, in general it is recommended that a maximum continuous service temperature of 130°C is observed.
Polyurethane resins generally have much faster cure times than epoxies and exhibit more flexibility and a wider range of shore hardness. Due to their elastomeric or rubbery state when cured, polyurethane resins are often the preferred choice when the electronics being potted which contain delicate components. This has led to wide a wide range of applications in the automotive and home appliance industries and increasingly polyurethane resins are being used as LED potting compounds for internal and external lighting applications.
Traditionally polyurethane resins can demonstrate a lower water resistance, especially at high temperatures, however Electrolube offer a range of products formulated especially for water resistance and are well suited to the automotive and marine industries. Similar to epoxies, the polyurethane resins usually come in two component systems, but usually display lower exotherm during the cure process, even with the faster curing systems.
For More details on the Chemistry of Polyurethane resins, have a look at our knowledge centre articles below:
Product code: UR5041RP250G - UR5041K1K - UR5041K5K - UR5041K25K
UR5041 is a two-part black encapsulation and potting compound formulated to perform to the highest levels.
Its high toughness and resistance to tearing mean that it offers excellent physical protection to the encapsulated electronics, while it has good adhesion to most substrates.
This resin system provides exceptional resistance to sea water, as well as temperature extremes of -60°C upto 125°C making it the ideal choice for marine applications such as sensor encapsulation.
For Full product specs please see the TDS link below.
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