Meeting the challenge of challenging environments
Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.More info > Download product selector chart > Download product brochure >
Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.
Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.
Example of Mixing instructions for Encapsulation Resins
Highly adhesive epoxy resin for adhesion or encapsulation.
Very low viscosity epoxy resin with excellent clarity.
Fast curing, low viscosity resin which is tough once cured.
Electrolube ER2001 is a general purpose epoxy potting compound designed primarily for use where UL94 V-0 flame retardant properties are required.
Two-part epoxy resin - flame retardant with excellent solvent resistance.
Medium viscosity, thermally conductive and flame retardant, two part encapsulating and potting compound
General purpose two part epoxy resin, flame retardant, encapsulating and potting compound
General purpose two part encapsulating and potting compound with high toughness.
Very low viscosity flame retardant resin two part potting and encapsulating compound
One-part epoxy resin suitable for dipping and glob-top
Highly thermally conductive epoxy, flame retardant, two part encapsulation compound
highly temperature resistant and thermally conductive potting compound
ER2223 black epoxy resin has been specially formulated to meet the harsh operating conditions of under-hood applications in the automotive industry.
ER2224 Epoxy potting compound is a highly thermally conductive resin (0.8 W/m*K) which also offers strong thermal cycling properties.
Specialist epoxy potting compound for automotive industry electronics
High temperature resistant, thermally conductive, two-part encapsulation compound based on epoxy technology
ER4002 is an ideal choice for automotive potting and encapsulation applications
Ultra high performance resin system with excellent water resistance - ideal marine resin
High performance, flame retardant encapsulation resin with low hardness - can be removed
Very soft, digoutable, low viscosity, flexible encapsulation resin
Very high performance resin gel with the ability to self-heal. Ideal marine resin.
Flame retardant, thermally conductive, two part encapsulating and potting compound
Low viscosity, two part encapsulating and potting compound with excellent resistance to sea water and good RF properties - good marine resin
Ultra-high performance potting compound. Thixotropic - allows ingress under components and into tight gaps.
Two part encapsulating and potting compound with excellent adhesion toughness and resistance to water.
Fast curing, Tough, resilient polyurethane resin.
Flame retardant polyurethane potting resin - ideal for applications protecting delicate components
Electrolube UR5597 is a polyurethane potting compound which has been formulated for use for cable joining applications
Two part, high performance potting resin for general purpose.
Two part, tough, high performance potting compound, ideal for applications where temperatures fluctuate.
Tough, Semi Rigid two part high performance polyurethane potting compound.
A flame retardant, thermally conductive resin with a wide operating temperature range and excellent water resistance.
A two-part, semi-rigid optically clear polyurethane resin - ideal for LED potting.
A two-part, semi-rigid polyurethane resin formulated with a 'hazy/cloudy' appearance. Ideal for LED potting.
A two-part, semi-rigid, white polyurethane resin - ideal for LED potting.
UR5638 is an optically clear / transparent polyurethane resin consisting of an aliphatic polymer
UR5639 is a flexible polyurethane resin designed primarily as an LED encapsulant,
Optically clear polyurethane resin ideal for LED encapsulation for aesthetic / protection
Isocyanate free, flexible encapsulation resin, with good rework properties.
SC2001 is a two-part, general purpose potting and encapsulating compound designed for the protection for electronic devices.
Optically clear, flexible, two part silicone encapsulating compound. Ideal for LED potting.
SC4003E is a two-part silicone potting and encapsulating resin designed for the protection of electronic devices.
OP9003 is a special non-flammable solvent blend designed to swell and soften cured epoxy, polyurethane and other resins and enable their removal from most substrates.
OP9004 is a special non-flammable solvent blend designed to swell and soften cured epoxy, polyurethane and other resins and enable their removal from most substrates.
OP9020 is a special solvent designed to remove epoxy and polyurethane resin