Encapsulation Resins

Meeting the challenge of challenging environments

  • UL approved
  • Potting / encapsulating
  • Sealing and protection
  • Cable jointing
  • Coloured and optically clear
  • Bespoke and ex-stock

Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.

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Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.

Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.


Example of Mixing instructions for Encapsulation Resins


More Information

Encapsulation Resins

Silicone

SC4003E - General Purpose Silicone Potting Compound

SC4003E
General Purpose Silicone Potting Compound

250G - 5Kg

Product code: SC4003ERP250G - SC4003EK5K


SC4003E is a two-part silicone potting and encapsulating resin designed for the protection of electronic devices. It has excellent high temperature properties, suitable for use in applications where the operating temperature will be up to 200°C. As with other silicone potting compounds it is soft and flexible offering protection to delicate components, while it has good flow characteristics allowing for easy potting of small or complex units such as small LED drivers. SC4003E also offers a simple mix ratio of 1:1 for ease of processing.


Key Properties:
  • Good flow characteristics to allow the potting of difficult and complex geometries
  • Simple 1:1 mix ratio, for ease of processing
  • Wide temperature range -60°C to +200°C
  • Soft resin, exhibits low stress on components
  • Room Temperature Cure
  • Black Potting Compound / Encapsulant
  • RoHS-2 Compliant

Product data sheets
SC4003 (tds) Download

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