Electrolube Polyurethane resins are specialist systems for potting and encapsulating printed circuit boards (PCBs), electronic components and devices. Polyurethane resin systems are designed to insulate the device from harsh environments acting as a barrier against contaminates such as moisture, chemicals and protection against physical shock and vibrations.More info > Download product selector chart > Download product brochure >
Polyurethane encapsulants offer several advantages over epoxies and silicones. They provide chemical, dust and moisture resistance, as well as exhibiting excellent electrical resistance and flexibility. They also have good adhesion to most substrates, both metal and plastic.
Due to the nature of the urethane bond, in general it is recommended that a maximum continuous service temperature of 130°C is observed.
Polyurethane resins generally have much faster cure times than epoxies and exhibit more flexibility and a wider range of shore hardness. Due to their elastomeric or rubbery state when cured, polyurethane resins are often the preferred choice when the electronics being potted which contain delicate components. This has led to wide a wide range of applications in the automotive and home appliance industries and increasingly polyurethane resins are being used as LED potting compounds for internal and external lighting applications.
Traditionally polyurethane resins can demonstrate a lower water resistance, especially at high temperatures, however Electrolube offer a range of products formulated especially for water resistance and are well suited to the automotive and marine industries. Similar to epoxies, the polyurethane resins usually come in two component systems, but usually display lower exotherm during the cure process, even with the faster curing systems.
For More details on the Chemistry of Polyurethane resins, have a look at our knowledge centre articles below:
Ultra high performance resin system with excellent water resistance - ideal marine resin
High performance, flame retardant encapsulation resin with low hardness - can be removed
Very soft, digoutable, low viscosity, flexible encapsulation resin
Very high performance resin gel with the ability to self-heal. Ideal marine resin.
Flame retardant, thermally conductive, two part encapsulating and potting compound
Low viscosity, two part encapsulating and potting compound with excellent resistance to sea water and good RF properties - good marine resin
Ultra-high performance potting compound. Thixotropic - allows ingress under components and into tight gaps.
Two part encapsulating and potting compound with excellent adhesion toughness and resistance to water.
Fast curing, Tough, resilient polyurethane resin.
Flame retardant polyurethane potting resin - ideal for applications protecting delicate components
Electrolube UR5597 is a polyurethane potting compound which has been formulated for use for cable joining applications
Two part, high performance potting resin for general purpose.
Two part, tough, high performance potting compound, ideal for applications where temperatures fluctuate.
Tough, Semi Rigid two part high performance polyurethane potting compound.
A flame retardant, thermally conductive resin with a wide operating temperature range and excellent water resistance.
A two-part, semi-rigid optically clear polyurethane resin - ideal for LED potting.
A two-part, semi-rigid polyurethane resin formulated with a 'hazy/cloudy' appearance. Ideal for LED potting.
A two-part, semi-rigid, white polyurethane resin - ideal for LED potting.
UR5638 is an optically clear / transparent polyurethane resin consisting of an aliphatic polymer
UR5639 is a flexible polyurethane resin designed primarily as an LED encapsulant,
Optically clear polyurethane resin ideal for LED encapsulation for aesthetic / protection
Optically clear, flame retardant polyurethane resin ideal for LED encapsulation.
UR5644 is a flame retardant polyurethane resin / potting compound which has a hazy, light defusing effect ideal for potting LEDs or other electronic components exposed to harsh environments.
High Performance potting and encapsulation compound