Electrolube’s silicone thermal interface materials are designed to perform in a range of operating environments in order to efficiently dissipate heat away from the operating device. These are mostly silicone thermal pastes best suited for use between a heat sink and electronic device. As with any thermal interface material, we would advise testing before a selection is made.More info > Download product selector chart > Download product brochure >
Silicone Thermal Interface Materials – otherwise referred to as thermal pastes or thermal greases, are materials which use a silicone based fluid combined with a number of other elements such as thermally conductive metal oxides in order to create a material which is a good conductor of heat, whilst maintaining its electrically insulating properties.
The finished product is a thermally conductive material which can be used in a range of electronic devices to manage the heat generated during operation, dissipating it away from components to the heat sink or other cooling device and thus allowing the component to operate more reliably and at higher speeds than would otherwise be possible.
Silicone thermal pastes can offer a higher upper operating temperature range than other formulations. Thermal greases can exhibit some migration of material, what is known as ‘pump-out’, whereby the pressure of the two surfaces meeting, combined with operation vibrations, results in the material being ‘pumped out’ to the edges of the bound surfaces, thereby reducing the efficiency of heat transfer in the centre.
While this is not the case in all silicone materials, in some applications it may be wise to consider non-silicones. Alternatively, Electrolube do offer enhanced versions of our thermal pastes known as the ‘Plus’ and ‘Xtra’ range which combines clever formulation techniques to enhance performance for certain applications.
Overall silicone thermal interface materials are suitable for use with a wide range of application conditions but are best used for high-temperature environments.
As with all thermal interface materials we would advise that you test any product you select thoroughly, as each application will vary from the next and figures quoted on a TDS may not match the results in the ‘real’ operating environment.
If you have any questions, please don’t hesitate to get in touch with our Technical Support Team, or alternately we have some great articles available:
Silicone Heat Transfer Compound is a metal oxide filled silicone oil
HTSP provides the ultimate in thermal conductivity
silicone thermal interface material which has been developed to perform in more extreme conditions
SCTP is a thermal interface material for use where the efficient thermal coupling of electrical components is required. It is specially designed to resist pumping out from the bond line and can be applied using industrial dispensing equipment or via screen/stencil printing techniques.
Thermally conductive putty / gel which allows for gap filling in applications where the thermal interface is vertical and the use of grease or paste would result in pump-out.