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Thermally Conductive Potting Compounds

Created to perform when the heat is on

Thermally Conductive Potting Compounds
  • Epoxies
  • Polyurethanes
  • Silicones
  • Two-Part systems
  • Encapsulation of components
  • Potting complete units

Thermally conductive potting compounds are resins designed to encapsulate components or ‘pot’ the entire PCB unit, dissipating heat away from the electronic components and in the process offering additional protection from environmental elements such as water or chemicals. Electrolube have a range of specialist epoxy, polyurethane and silicone resins which have been designed for this specific purpose.

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Thermally conductive resins can be used to pot a PCB unit, or encapsulate electronic components in order to transfer heat away, either to the housing or the resin itself acting as a simple heatsink. Potting a PCB with thermally conductive resin will allow the material to flow into spaces around components which would otherwise not be suitable for thermal interface materials, and can be an efficient way to manage thermal transfer over a whole unit.

The added benefit to using a thermally conductive potting compound is that it also provides additional protection to the PCB. The additional properties will vary depending on the resin chemistry selected, and application requirements but usually include some or all of the following examples; damage /shock resistance, water resistance, chemical and gas resistance as well as offering some structural support.

A good example of where the use of a thermally conductive resin can benefit over a standard thermal interface material is in an LED unit where even small increases in temperature can affect the colour, life expectancy and performance of the LED. By potting with a thermally conductive resin we can easily manage this temperature, while also offering additional properties to protect the LED PCB from corrosive elements such as rain water.

We would advise that you test any product you select thoroughly, as each application will vary from the next and figures quoted on a TDS may not match the results in the ‘real’ operating environment.

If you have any questions, please don’t hesitate to get in touch with our Technical Support Team, or alternately we have some great articles available:

Thermal Management Solutions

Thermally Conductive Potting Compounds

SC2001 - Heat Cured Silicone Resin

Heat Cured Silicone Resin

250g - 5KG

Product code: SC2001RP250G - SC2001K5K

SC2001 is a two-part, general purpose potting and encapsulating compound designed for the protection for electronic devices. It has exceptional high temperature properties, suitable for use in applications where the operating temperature will be up to 200°C. SC2001 Must be cured using heat.

Key Properties:
  • Heat Cured Silicone
  • Dark Grey
  • General purpose silicone resin
  • Excellent high temperature performance
  • Simple 1:1 mix ratio
  • Excellent chemical and water resistance

Product data sheets
SC2001 (tds) Download

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