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Thermal Gap Filler Material

Created to perform when the heat is on

Thermal Gap Filler Material
  • RTV’s
  • Paste
  • Bulk application / syringe available
  • Bonding / non-bonding

Gap fillers may be used in any application where thermal dissipation is required between two surfaces, generally they are applied more thickly than thermal pastes and usually between devices and their housing to fill the gap.

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Thermal interface gap fillers are materials designed to fill the gap between surfaces, components or housing joints in order to improve heat transfer. Air pockets, no matter how small can ‘trap’ heat by increasing thermal resistance and therefore filling this gap with a specialist heat transfer material will increase thermal conductivity, dissipating heat away from the target area in order to cool the component.

Generally gap filler material is thicker than standard thermal paste, to ensure stability in thicker films. It is important that the material is still applied at the thinnest layer required to fill the gap, in order to achieve maximum efficiency of heat transfer. These materials are most commonly applied using a syringe or needle applicator.

Electrolube’s range includes RTV curing materials which may also double up as a gap filling material.

As with all thermal interface materials we would advise that you test any product you select thoroughly, as each application will vary from the next and figures quoted on a TDS may not match the results in the ‘real’ operating environment.

If you have any questions, please don’t hesitate to get in touch with our Technical Support Team, or alternately we have some great articles available:

Thermal Management Solutions

Thermal Gap Filler Material

GF300 -  GF300  Gap Filler

GF300
GF300 Gap Filler

400ml

Product code: GF300_400ML


GF300 is a two part, liquid silicone based gap filler, which provides excellent thermal performance (4.0 W/m.K) and can be cured at room temperature or accelerated with heat. After curing GF400 forms a low modulus elastomer preventing the 'pump-out phenomenon'.


Key Properties:
  • Soft and compliant for low stress applications
  • Low viscosity; easy to dispense
  • High thermal conductivity
  • Low modulus elastomer, prevents 'pump-out'

Product data sheets
GF300 (tds) Download

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