Created to perform when the heat is on
Gap fillers may be used in any application where thermal dissipation is required between two surfaces, generally they are applied more thickly than thermal pastes and usually between devices and their housing to fill the gap.More info > Download product selector chart > Download product brochure >
Thermal interface gap fillers are materials designed to fill the gap between surfaces, components or housing joints in order to improve heat transfer. Air pockets, no matter how small can ‘trap’ heat by increasing thermal resistance and therefore filling this gap with a specialist heat transfer material will increase thermal conductivity, dissipating heat away from the target area in order to cool the component.
Generally gap filler material is thicker than standard thermal paste, to ensure stability in thicker films. It is important that the material is still applied at the thinnest layer required to fill the gap, in order to achieve maximum efficiency of heat transfer. These materials are most commonly applied using a syringe or needle applicator.
Electrolube’s range includes RTV curing materials which may also double up as a gap filling material.
As with all thermal interface materials we would advise that you test any product you select thoroughly, as each application will vary from the next and figures quoted on a TDS may not match the results in the ‘real’ operating environment.
If you have any questions, please don’t hesitate to get in touch with our Technical Support Team, or alternately we have some great articles available:
Product code: TCOR75S
Electrolube TCOR is a single component, 100% solids, low odour RTV which cures upon exposure to atmospheric moisture. The product offers a high degree of thermal conductivity and is suitable for use over a very wide temperature range, making it ideal for a wide variety of uses, particularly in automotive applications. Combining the properties of silicone rubber pads with those of a conventional heat transfer paste, TCOR has been designed to fill the gap between the device and heat sink, thus reducing the thermal resistance. It can be applied around components and power resistors to dissipate excess heat to heat sinks, avoiding any potential overheating and subsequent failures. It can be used as a low bond strength adhesive, sealant or gasketing compound.
Log into our MSDS database for Safety Data Sheets: MSDS