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Thermal Management of LEDs

The thermal management of the LED and the unit is a vitally important consideration for the reliability of an LED unit.
  • Thermal Pastes
  • Phase Change Material
  • Gap Pads
  • Thermal Bonding
  • RTVs
  • Encapsulation Resins

The thermal management of the LED and the unit is a vitally important consideration for the reliability of an LED unit. A variation of just one single degree centigrade can effect both the life of the LED, (the higher the temperature the unit is running at the faster the luminaire degrades) as well as the efficiency, ( the lower the temperature, the more efficient the luminaire is at producing light).

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With a single degree centigrade of heat having such a large effect on the efficiency and the lifetime of an LED Luminaire, the thermal interface material chosen for the LED design is of vital importance.

Electrolube offer a wide range of thermal interface materials including curing and non-curing pastes, gap pads, phase change materials (facilitating easy rework), as well as a selection of encapsulation resins which are designed to dissipate the heat away from the components to the housing.

If you have any questions our dedicated technical support team are on hand to answer your questions and don’t forget that our LED brochure contains vast amount of collaborative test data from Bridgelux comparing data to help you select the right material.

If you would like to read in more detail about the effects of effective thermal management on LED units, we have several articles you may be interested in:

LED Industry

Thermal Management of LEDs

TCOR  - Thermally Conductive Oxime RTV

TCOR
Thermally Conductive Oxime RTV

75ml

Product code: TCOR75S


Electrolube TCOR is a single component, 100% solids, low odour RTV which cures upon exposure to atmospheric moisture. The product offers a high degree of thermal conductivity and is suitable for use over a very wide temperature range, making it ideal for a wide variety of uses, particularly in automotive applications. Combining the properties of silicone rubber pads with those of a conventional heat transfer paste, TCOR has been designed to fill the gap between the device and heat sink, thus reducing the thermal resistance. It can be applied around components and power resistors to dissipate excess heat to heat sinks, avoiding any potential overheating and subsequent failures. It can be used as a low bond strength adhesive, sealant or gasketing compound.


Key Properties:
  • Single part, low odour RTV
  • Very high thermal conductivity: 1.80 W/m.
  • Exceptionally wide operating temperature range: -50°C to +230°C
  • Moisture cure - releasing oxime upon cure
  • Easy to apply - use with TCR Gun Applicator
  • Good bond strength and remains flexible at high temperatures

Product data sheets
TCOR (tds) Download

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