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Non-Silicone Thermal Interface Materials

Non-Silicone Thermal Interface Materials
  • Non-Silicone thermal pastes
  • Non-Silicone gap fillers
  • Non-Silicone thermal greases
  • Curing / non-curing options
  • Low creep + low pump-out
  • Wide operating ranges

Electrolube non-silicone thermal interface materials are specialist pastes and greases designed to dissipate heat away from electronic components and thus improve their operating efficiency. These products have been specially selected for a wide range of projects across the globe where efficient thermal management is required.

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Thermal Interface Materials – otherwise referred to as thermal paste or thermal grease, are materials which use a thermally conductive filler such as a metal oxide, combined with a carrier fluid in order to create a material which is a good conductor of heat, whilst maintaining its electrically insulating properties. Electrolube non-silicone based materials use specialised carriers in place of silicone oils in order to offer silicone-free alternatives for those applications that prohibit the use of silicones. The choice of fillers, base oils, additives and mixing procedures can have a dramatic effect on the final properties of the paste.

The finished product is a thermally conductive material which can be used in a range of electronic devices to manage the heat generated during operation, dissipating it away from components to the heat sink or other cooling device and thus allowing the component to operate more reliably and at higher speeds than would otherwise be possible.

By clever formulation products such as Electrolube ‘Xtra’ range can achieve enhanced characteristics such as a higher thermal conductivity and lower oil bleed, with no compromise on usability, viscosity or thermal resistance.

There are a number of differences in performance to the silicone thermal pastes, these include higher dielectric strength, and a lower evaporation weight loss than the silicones. With some products such as the ‘Xtra’ range exhibiting improved resistance to changes in humidity and thermal shock. However as a general rule, the operating temperature range of non-silicone thermal paste is not quite as wide as their silicone based counterparts.

As with all thermal interface materials we would advise that you test any product you select thoroughly, as each application will vary from the next and figures quoted on a TDS may not match the results in the ‘real’ operating environment.

If you have any questions, please don’t hesitate to get in touch with our Technical Support Team, or alternately we have some great articles available:

Thermal Management Solutions

Non-Silicone Thermal Interface Materials

HTCPX  - Non-Silicone Heat Transfer Compound PLUS Xtra

Non-Silicone Heat Transfer Compound PLUS Xtra

700g - 25kg

Product code: HTCPX700G - HTCPX25K

HTCPX provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. The exceptional properties obtained from HTCPX are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.

The product contains no silicones and thus cannot migrate onto electrical contacts with consequent high contact resistance, arcing or mechanical wear. Similarly soldering problems caused by silicones will not been ecountered.

Key Properties:
  • Excellent non-creep charactistics
  • Vibration stable, designed for gap filling applications
  • Wide operating temperature range: -50°C to +180°C
  • Exceptional thermal conductivity: 3.40 W/m.K
  • Low in toxicity
  • Low evaporation weight loss

Product data sheets
HTCPX (tds) Download

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