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Silicone Thermal Interface Materials

Silicone Thermal Interface Materials (Thermal Paste)
  • Silicone thermal pastes
  • Silicone gap fillers
  • Silicone thermal greases
  • Curing / non-curing options
  • Low creep + low pump-out
  • Wide operating ranges

Electrolube’s silicone thermal interface materials are designed to perform in a range of operating environments in order to efficiently dissipate heat away from the operating device. These are mostly silicone thermal pastes best suited for use between a heat sink and electronic device. As with any thermal interface material, we would advise testing before a selection is made.

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Silicone Thermal Interface Materials – otherwise referred to as thermal pastes or thermal greases, are materials which use a silicone based fluid combined with a number of other elements such as thermally conductive metal oxides in order to create a material which is a good conductor of heat, whilst maintaining its electrically insulating properties.

The finished product is a thermally conductive material which can be used in a range of electronic devices to manage the heat generated during operation, dissipating it away from components to the heat sink or other cooling device and thus allowing the component to operate more reliably and at higher speeds than would otherwise be possible.

Silicone thermal pastes can offer a higher upper operating temperature range than other formulations. Thermal greases can exhibit some migration of material, what is known as ‘pump-out’, whereby the pressure of the two surfaces meeting, combined with operation vibrations, results in the material being ‘pumped out’ to the edges of the bound surfaces, thereby reducing the efficiency of heat transfer in the centre.

While this is not the case in all silicone materials, in some applications it may be wise to consider non-silicones. Alternatively, Electrolube do offer enhanced versions of our thermal pastes known as the ‘Plus’ and ‘Xtra’ range which combines clever formulation techniques to enhance performance for certain applications.

Overall silicone thermal interface materials are suitable for use with a wide range of application conditions but are best used for high-temperature environments.

As with all thermal interface materials we would advise that you test any product you select thoroughly, as each application will vary from the next and figures quoted on a TDS may not match the results in the ‘real’ operating environment.

If you have any questions, please don’t hesitate to get in touch with our Technical Support Team, or alternately we have some great articles available:

Thermal Management Solutions

Silicone Thermal Interface Materials (Thermal Paste)

TCP400 - Thermally Conductive Putty

Thermally Conductive Putty


Product code: TCP400

TPC400 is a single part dispensable material with high heat transfer performance. The unique formulation means TCP400 can be used on vertical surfaces, it is very soft and exerts low stress on components; the low modulus elastomer shows excellent 'pump-out' resistance and minimal oil bleed. TCP400 can be used as supplied, it requires no pre-mixing and is ideal for automated applications for simple processing.

Key Properties:
  • Simple process; single part dispensable material, easy application
  • No drip and minimal crack when applied on vertical surfaces
  • High thermal conductivity; 4.0 W/mK
  • Moderate surface tack making it easy for rework

Product data sheets
TCP400 (tds) Download

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