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Technical Articles

Technical Articles

Effective Thermal Management

Posted on 12 August 2014 by Electrolube
Tags: Thermal Management, Encapsulation Resins

During use, some electronic components can generate significant amounts of heat. Failure to effectively dissipate this heat away from the component and the device can lead to reliability concerns and reduced operational lifetimes. Newton’s law of cooling states that the rate of loss of heat is proportional to the temperature difference between the body and its surroundings. Therefore, as the temperature of the component increases and reaches its equilibrium temperature, the rate of heat loss per second will equate to the heat produced per second within the component. This temperature may be high enough to significantly shorten the life of the component or even cause the device to fail. It is in such cases that thermal management measures need to be taken. The same considerations can be applied to a complete circuit or device which incorporates heat producing individual components. Read more >

Resins for potting and encapsulation in the electronics and electrical industries

Posted on 01 October 2009 by Electrolube
Tags: Encapsulation Resins

Resins used for these applications can be of various chemical types. Epoxy resins have been widely used for many years – they are generally hard and tough and exhibit low shrinkage on cure. They are characterised by an excellent level of mechanical properties, good high temperature performance and good adhesion to a wide variety of substrates – chemical resistance is also good. The cross-linking or curing process generally takes place slowly especially where small volumes of resin are involved. Fast cure hardeners can be used but these generate…

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